IBM Telum (microprocessor)

The Telum is a microprocessor made by IBM for their IBM Z mainframe computers, announced at the Hot Chips 2021 conference on August 23, 2021. Telum is IBM's first processor that contains on-chip acceleration for AI inferencing while a transaction is taking place.[1] A Telum-based system is planned for the first half of 2022.[2][3][4]

Telum
General information
Launched2021
Designed byIBM
Performance
Max. CPU clock rate>5 GHz
Cache
L2 cache32 MB
per core
Architecture and classification
Technology node7 nm
Instruction setz/Architecture
Physical specifications
Cores
  • 8
History
Predecessorz15

Description

The chip contains 8 processor cores with a deep superscalar out-of-order pipeline, running with more than 5 GHz clock frequency, optimized for the demands of heterogenous enterprise class workloads. The completely redesigned cache and chip-interconnection infrastructure provides 32 MB cache per core, and can scale to 32 Telum chips. The dual-chip module design contains 22 billion transistors and 19 miles of wire on 17 metal layers.[5][6][7]

See also

References
  1. Combs, Veronica (2021-08-24). "IBM's new Telum Processor is the company's first with an on-chip AI accelerator". TechRepublic. Retrieved 2021-08-27.
  2. "IBM Unveils On-Chip Accelerated Artificial Intelligence Processor" (Press release). IBM. August 23, 2021.
  3. "IBM Telum Processor: the next-gen microprocessor for IBM Z and IBM LinuxONE". IBM. August 23, 2021.
  4. "New Approaches For Processor Architectures". Semiconductor Engineering. August 23, 2021.
  5. Cutress, Dr Ian. "Did IBM Just Preview The Future of Caches?". www.anandtech.com. Retrieved 2022-05-05.
  6. "IBM's New Telum Chip Reboots the Mainframe". IEEE Spectrum. 2022-04-29. Retrieved 2022-05-05.
  7. I Tried to Break a Million Dollar Computer - IBM Z16 Facility Tour!, retrieved 2022-05-05
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